170M5763詳細規(guī)格
- 類別:保險絲 - 電氣,特制
- 描述:FUSE 700A 690V 2FKE/115 AR UC
- 系列:-
- 制造商:Cooper Bussmann
- 保險絲類型:快速熔斷
- 電壓_額定:690VAC
- 電流:700A
- 封裝/外殼:矩形,插片
- 大小/尺寸:6.260" L x 2.402" W x 3.031" H(159.00mm x 61.00mm x 77.00mm)
- 安裝類型:螺栓安裝
- 顏色:-
- 工作溫度:-
- 其它 3M HI STRNGTH ROLL 9X30’ A VFN
- 保險絲 - 電氣,特制 Cooper Bussmann 矩形,插片 FUSE 550A 690V 2FKE/115 AR UC
- 芯片電阻 - 表面安裝 Yageo 0805(2012 公制) RES 619K OHM 1/8W 1% 0805 SMD
- 矩形- 接頭,公引腳 TE Connectivity 0805(2012 公制) CONN HEADER 18POS R/A SMD TIN
- 邏輯 - 鎖銷 NXP Semiconductors 20-TSSOP(0.173",4.40mm 寬) IC OCTAL TRANSP LTCH 3ST 20TSSOP
- 其它 3M 20-TSSOP(0.173",4.40mm 寬) HI STRNGTH SHEET 3-2/3X9" A VFN
- 其它 3M 20-TSSOP(0.173",4.40mm 寬) FINISHING FLAP BRUSH 7A FIN
- D-Sub Norcomp Inc. 20-TSSOP(0.173",4.40mm 寬) CONN DB25 MALE HI PRO YLW CHROME
- 其它 3M SE SURFACE DISC 7X7/8" A CRS
- 矩形- 接頭,公引腳 TE Connectivity 矩形,插片 CONN HEADER 11POS VERT SMD TIN
- 邏輯 - 鎖銷 Fairchild Semiconductor 20-SOIC(0.209",5.30mm 寬) IC OCT TRANSP LATCH 3ST 20SOP
- 其它 3M 20-SOIC(0.209",5.30mm 寬) HI STRNGTH SHEET 3-2/3X9" A VFN
- 其它 3M 20-SOIC(0.209",5.30mm 寬) FINISHING FLAP BRUSH 5A VFN
- D-Sub Norcomp Inc. 20-SOIC(0.209",5.30mm 寬) CONN DB25 MALE HIGH PROFILE TIN
- 芯片電阻 - 表面安裝 Yageo 0805(2012 公制) RES 6.20K OHM 1/8W 1% 0805 SMD