ACC30DRYS-S93詳細規(guī)格
- 類別:Card Edge, Edgeboard Connectors
- 描述:CONN EDGECARD 60POS DIP .100 SLD
- 系列:-
- 制造商:Sullins Connector Solutions
- 卡類型:非指定 - 雙邊
- 公母:母頭
- 位/盤/排數(shù):30
- 針腳數(shù):60
- 卡厚度:0.093"(2.36mm)
- 排數(shù):2
- 間距:0.100"(2.54mm)
- 特性:-
- 安裝類型:通孔
- 端接:焊接
- 觸頭材料:銅鈹
- 觸頭鍍層:金
- 觸頭鍍層厚度:30µin(0.76µm)
- 觸頭類型:全波紋管
- 顏色:綠
- 包裝:托盤
- 法蘭特性:側面安裝開口,無螺紋,0.125"(3.18mm)直徑
- 晶體 TXC CORPORATION 4-SMD,無引線(DFN,LCC) CRYSTAL 27.000 MHZ 18PF SMD
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 4-SMD,無引線(DFN,LCC) CONN EDGECARD 60POS DIP .100 SLD
- 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 Analog Devices Inc 64-VFQFN 裸露焊盤,CSP IC ADC 14BIT SRL 65MSPS 64LFCSP
- 薄膜 Cornell Dubilier Electronics (CDE) 軸向 CAP FILM 3UF 200VDC AXIAL
- D-Sub TE Connectivity 軸向 26 50SR VRT RCPT,L,R,ACT PIN
- 晶體 Abracon Corporation 2-SMD CRYSTAL 27.000 MHZ 18PF SMD
- 矩形- 接頭,公引腳 3M 2-SMD CONN HEADER .100 DUAL STR 38POS
- 晶體 TXC CORPORATION 4-SMD,無引線(DFN,LCC) CRYSTAL 27.120 MHZ 12PF SMD
- Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps Analog Devices Inc 6-UFDFN 裸露焊盤,CSP IC AMP CCD BUFFER HS LP 6LFCSP
- D-Sub TE Connectivity 48-VFQFN 裸露焊盤,CSP CONN RECEPT 100POS VERT .05 GOLD
- 薄膜 Cornell Dubilier Electronics (CDE) 軸向 CAP FILM 3UF 200VDC AXIAL
- 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 Analog Devices Inc 44-QFP IC ADC CMOS 16BIT OVRSAMP 44MQFP
- Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps Analog Devices Inc 8-VFDFN 裸露焊盤,CSP IC OPAMP VF 410MHZ LN 8LFCSP
- 晶體 TXC CORPORATION 4-SMD,無引線(DFN,LCC) CRYSTAL 27.1200 MHZ 18PF SMD
- 晶體 Abracon Corporation 2-SMD CRYSTAL 29.4912MHZ 18PF SMD