RCC19DRYI-S93 全國供應商、價格、PDF資料
RCC19DRYI-S93詳細規(guī)格
- 類別:Card Edge, Edgeboard Connectors
- 描述:CONN EDGECARD 38POS DIP .100 SLD
- 系列:-
- 制造商:Sullins Connector Solutions
- 卡類型:非指定 - 雙邊
- 公母:母頭
- 位/盤/排數(shù):19
- 針腳數(shù):38
- 卡厚度:0.093"(2.36mm)
- 排數(shù):2
- 間距:0.100"(2.54mm)
- 特性:-
- 安裝類型:通孔
- 端接:焊接
- 觸頭材料:磷青銅
- 觸頭鍍層:金
- 觸頭鍍層厚度:30µin(0.76µm)
- 觸頭類型:全波紋管
- 顏色:綠
- 包裝:托盤
- 法蘭特性:頂部安裝開口,螺紋插件,4-40
- 邏輯 - 觸發(fā)器 STMicroelectronics 14-TSSOP(0.173",4.40mm 寬) IC FLIP FLOP DUAL J-K 14-TSSOP
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 14-TSSOP(0.173",4.40mm 寬) CONN EDGECARD 60POS R/A .125 SLD
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 14-TSSOP(0.173",4.40mm 寬) CONN EDGECARD 38POS DIP .100 SLD
- DC DC Converters Recom Power 24-DIP 模塊(9 引線) CONV DC/DC 6W 9-18VIN 24VOUT
- 嵌入式 - FPGA(現(xiàn)場可編程門陣列) Microsemi SoC 484-BGA IC FPGA 1KB FLASH 1M 484-FBGA
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 484-BGA CONN EDGECARD 20POS R/A .156 SLD
- 芯片電阻 - 表面安裝 Susumu 1206(3216 公制) RES 360 OHM 1/4W .5% 1206
- 芯片電阻 - 表面安裝 Susumu 0805(2012 公制) RES 162K OHM 1/8W .25% 0805
- 邏輯 - 觸發(fā)器 STMicroelectronics 14-TSSOP(0.173",4.40mm 寬) IC FLIP FLOP DUAL D 14-TSSOP
- DC DC Converters Recom Power 24-DIP 模塊(7 引線) CONV DC/DC 6W 18-36VIN +/-05VOUT
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 24-DIP 模塊(7 引線) CONN EDGECARD 20POS R/A .156 SLD
- 嵌入式 - FPGA(現(xiàn)場可編程門陣列) Microsemi SoC 208-BFQFP IC FPGA 1KB FLASH 1M 208-PQFP
- 芯片電阻 - 表面安裝 Susumu 1206(3216 公制) RES 3.6K OHM 1/4W .1% 1206
- 芯片電阻 - 表面安裝 Susumu 0805(2012 公制) RES 162K OHM 1/8W .05% 0805 SMD
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 0805(2012 公制) CONN EDGECARD 60POS R/A .125 SLD