EDA包括些什么?
發(fā)布時(shí)間:2007/4/23 0:00:00 訪問次數(shù):1943
Traditionally, electronic design automation (EDA) has been associated with IC design. The first tools were for transistor-level simulation;they evolved at Cal Berkeley to become Spice. The next class of tools were the computer-aided design (CAD) tools that helped designers interconnect the individual devices. Because these were the only tools available, CAD and EDA became synonymous with the IC design process.
This grouping of all EDA as IC design continues today. There are more than 150 IC design, verification and analysis tools in some companies, and the bulk of the EDA revenues come from the IC design sector. Although some add the additional category of computer aided manufacturing (CAM), that is more related to the actual manufacturing functions of running a factory.
The problem with this narrow definition of EDA is that it excludes some significant categories of tools. Electronic systems include many components besides ICs-there are printed-circuit boards, packaging, wiring and even software. To take the collection of components beyond the condition of a box full of parts, the manufacturing side must perform many assembly and test operations as well as test and analyze reliability and quality assurance.
As systems move through the continuum of processes of design and manufacturing, one of the important functions is the design for manufacturability (DFM) assessment. In the IC design phase, this review occurs after physical design in the parasitic extraction and analysis tools. The analysis may miss some important factors because the IC design process is fragmented into facets of consideration like timing, power, noise and reliability. The point tools that look at the various functions work in relative isolation.
At the pc-board level, the DFM analysis considers physical and electrical parameters like dimensions, noise and crosstalk, and device placement and placement order. This analysis phase starts to let the manufacturing considerations like vendor quality and delivery capabilities intrude into the review. A pc board might have a problem in manufacturing at one vendor, or some selected components may have unusual delivery or quality constraints. These constraints need to be addressed as early in the design&nb
Traditionally, electronic design automation (EDA) has been associated with IC design. The first tools were for transistor-level simulation;they evolved at Cal Berkeley to become Spice. The next class of tools were the computer-aided design (CAD) tools that helped designers interconnect the individual devices. Because these were the only tools available, CAD and EDA became synonymous with the IC design process.
This grouping of all EDA as IC design continues today. There are more than 150 IC design, verification and analysis tools in some companies, and the bulk of the EDA revenues come from the IC design sector. Although some add the additional category of computer aided manufacturing (CAM), that is more related to the actual manufacturing functions of running a factory.
The problem with this narrow definition of EDA is that it excludes some significant categories of tools. Electronic systems include many components besides ICs-there are printed-circuit boards, packaging, wiring and even software. To take the collection of components beyond the condition of a box full of parts, the manufacturing side must perform many assembly and test operations as well as test and analyze reliability and quality assurance.
As systems move through the continuum of processes of design and manufacturing, one of the important functions is the design for manufacturability (DFM) assessment. In the IC design phase, this review occurs after physical design in the parasitic extraction and analysis tools. The analysis may miss some important factors because the IC design process is fragmented into facets of consideration like timing, power, noise and reliability. The point tools that look at the various functions work in relative isolation.
At the pc-board level, the DFM analysis considers physical and electrical parameters like dimensions, noise and crosstalk, and device placement and placement order. This analysis phase starts to let the manufacturing considerations like vendor quality and delivery capabilities intrude into the review. A pc board might have a problem in manufacturing at one vendor, or some selected components may have unusual delivery or quality constraints. These constraints need to be addressed as early in the design&nb
熱門點(diǎn)擊
- 國內(nèi)外EAD軟件淺視
- 基于FPGA的高級(jí)數(shù)據(jù)加密AES中的字節(jié)替換
- 一種電子專利附圖的制作方法
- EDA包括些什么?
- 開關(guān)電容器現(xiàn)場(chǎng)可編程模擬陣列的頻域SPICE
- G.726語音編解碼器在SoPC中的實(shí)現(xiàn)
- PSPICE的應(yīng)用Ⅰ
- 利用APTIXMP3C和Spartan-II
- 基于EDA的交通燈控制系統(tǒng)
- 基于CPLD的電子存包系統(tǒng)的設(shè)計(jì)與實(shí)現(xiàn)
推薦技術(shù)資料
- 聲道前級(jí)設(shè)計(jì)特點(diǎn)
- 與通常的Hi-Fi前級(jí)不同,EP9307-CRZ這臺(tái)分... [詳細(xì)]
- CV/CC InnoSwitch3-AQ 開
- URF1DxxM-60WR3系
- 1-6W URA24xxN-x
- 閉環(huán)磁通門信號(hào)調(diào)節(jié)芯片NSDRV401
- SK-RiSC-SOM-H27X-V1.1應(yīng)
- RISC技術(shù)8位微控制器參數(shù)設(shè)
- 多媒體協(xié)處理器SM501在嵌入式系統(tǒng)中的應(yīng)用
- 基于IEEE802.11b的EPA溫度變送器
- QUICCEngine新引擎推動(dòng)IP網(wǎng)絡(luò)革新
- SoC面世八年后的產(chǎn)業(yè)機(jī)遇
- MPC8xx系列處理器的嵌入式系統(tǒng)電源設(shè)計(jì)
- dsPIC及其在交流變頻調(diào)速中的應(yīng)用研究