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列出影響制造成本的主要因素

發(fā)布時間:2015/11/13 21:08:43 訪問次數(shù):821

   1.列出影響制造成本的主要因素。NCP1450ASN50T1G

   2.描述擁有成本( C00)模型的意圖和因素。

   3.列出統(tǒng)計制程控制的優(yōu)點。

   4.識別控制圖的構(gòu)成和用途。

   5.列出并討論自動化的不同水平。

   6.列出用來評估某種特定設(shè)備的因素。

   7.定義術(shù)語CIM和CAM.以及它們在生產(chǎn)設(shè)置中的作用。

            [ 1 ]   Semi/Semetech,Sem/  Reports ,2012 ,www. semi. org, May 2013.

        [ 2]  Clark,P.," GlobaIFoundries Hints at $10 Billion Fab Location,"  EE Times,Jan. 11 ,2013.

         [ 3 ]  Harper,J. G. and Bailey,L. G., " Flexible Material Handling Automation in Wafer Fabrication, " SoLid State

              Techn.ology,Jul. 1984 :94.

     [4] Lam,D.,"Minifabs Lower Bamers t0 300 mm," Solid State Techn.ology,Jan.1999:72.

            [ 5 ]   Sonderman ,T. ,Reaping the  Benejtts  of the 450-mm  Transition. , Semicon  West , San  F'rancisco , CA : 201 1 .

            [ 6 ]   Arden , W., Brillouet , M., Cogez , P., et  al.,More  Than. Moore  White  Paper ,ITRS  White  Paper, Nov. 8 ,2011.

       [7]  Foster,L. and Pollal,D.,300-m,m Wafer Fab Logistics an,d Automated MateriaL Han,dlin,g Systems,llan,dbook

        of Semiconductor Manujacturin,g Techn.ology,2007,CRC Press,New York,NY:33-17.

       [8]  Burggraaf, P., " Applying Cost Modeling to Stepper Lithography," Semicon,ductor In.tern,ation,aL, Cahners

                    Publishing, Feb. 1994 :40.

            [ 9 ]  Shinoda , S., " Total  Automation  in  Wafer  Fabrication , "  Semicon,ductor In,tern,ation,aL , Sep.  1986 :87.

       [ 10 ]  Singer,P.," The Thinking behind Today' s Cluster Tools, "  Semiconductor Intern,ation.al, Aug. 1993 :46.

      [11]  Foster,L. and Pollal,D.,300-mm Wafer Fab Logistics an,d Automated Material Han,dlin,g Systems,llandbook

                       oj' Semicon,ductor Manufacturin,g  Techn,ology,2007 , CRC  Press , New  York , NY : 33 -17.

       [ 12 ]  Moslehi,M., " Single-Wafer Processing Tools for Agile Semiconductor Production, "So//d State. Techn,ology,

                 PennWell Publications,Jan. 1994 :35.

     [13] Sonderman,T.,Reapin,g the Ben,ejits of the 450-mm Transition,Semicon West,CA :2011.

      [ 14]  Kerby,R. and Novak,L.,"ESH: A Green Fab begins with You," Solid State Techn,ology,Jan. 1998 :82.

      [ 15]  Campbell, D. M. and Ardehale, Z., " Process Control for Semiconductor Manufacturing,"  Semicon.du,ctor

                  Intern,ationaI,Jun. 1984 : 127.

       [ 16 ]  Levinson,W., " Statistical Process Control in Microelectronics Manufacturing," Semiconductor In.tern.atiotzal,

                       Cahners  Publishing,Nov. 1994 :95.

       [ 17 ]  Levy,K., " Productivity and Process Feedback, "  Solid State Technology,Jul. 1984:177.

  [18] Ibid.

       [ 19 ]  Hnatek,E., "IS0 9000 in the Semiconductor Industry, "  Semicon,du.ctor In,tern,ation,aI,Jul. 1993 :88.

      [ 20]  Dunn,P.,"The Unexpected Benefits of IS0 9000," Solid State Techn,ology,Mar. 1994:55.


   1.列出影響制造成本的主要因素。NCP1450ASN50T1G

   2.描述擁有成本( C00)模型的意圖和因素。

   3.列出統(tǒng)計制程控制的優(yōu)點。

   4.識別控制圖的構(gòu)成和用途。

   5.列出并討論自動化的不同水平。

   6.列出用來評估某種特定設(shè)備的因素。

   7.定義術(shù)語CIM和CAM.以及它們在生產(chǎn)設(shè)置中的作用。

            [ 1 ]   Semi/Semetech,Sem/  Reports ,2012 ,www. semi. org, May 2013.

        [ 2]  Clark,P.," GlobaIFoundries Hints at $10 Billion Fab Location,"  EE Times,Jan. 11 ,2013.

         [ 3 ]  Harper,J. G. and Bailey,L. G., " Flexible Material Handling Automation in Wafer Fabrication, " SoLid State

              Techn.ology,Jul. 1984 :94.

     [4] Lam,D.,"Minifabs Lower Bamers t0 300 mm," Solid State Techn.ology,Jan.1999:72.

            [ 5 ]   Sonderman ,T. ,Reaping the  Benejtts  of the 450-mm  Transition. , Semicon  West , San  F'rancisco , CA : 201 1 .

            [ 6 ]   Arden , W., Brillouet , M., Cogez , P., et  al.,More  Than. Moore  White  Paper ,ITRS  White  Paper, Nov. 8 ,2011.

       [7]  Foster,L. and Pollal,D.,300-m,m Wafer Fab Logistics an,d Automated MateriaL Han,dlin,g Systems,llan,dbook

        of Semiconductor Manujacturin,g Techn.ology,2007,CRC Press,New York,NY:33-17.

       [8]  Burggraaf, P., " Applying Cost Modeling to Stepper Lithography," Semicon,ductor In.tern,ation,aL, Cahners

                    Publishing, Feb. 1994 :40.

            [ 9 ]  Shinoda , S., " Total  Automation  in  Wafer  Fabrication , "  Semicon,ductor In,tern,ation,aL , Sep.  1986 :87.

       [ 10 ]  Singer,P.," The Thinking behind Today' s Cluster Tools, "  Semiconductor Intern,ation.al, Aug. 1993 :46.

      [11]  Foster,L. and Pollal,D.,300-mm Wafer Fab Logistics an,d Automated Material Han,dlin,g Systems,llandbook

                       oj' Semicon,ductor Manufacturin,g  Techn,ology,2007 , CRC  Press , New  York , NY : 33 -17.

       [ 12 ]  Moslehi,M., " Single-Wafer Processing Tools for Agile Semiconductor Production, "So//d State. Techn,ology,

                 PennWell Publications,Jan. 1994 :35.

     [13] Sonderman,T.,Reapin,g the Ben,ejits of the 450-mm Transition,Semicon West,CA :2011.

      [ 14]  Kerby,R. and Novak,L.,"ESH: A Green Fab begins with You," Solid State Techn,ology,Jan. 1998 :82.

      [ 15]  Campbell, D. M. and Ardehale, Z., " Process Control for Semiconductor Manufacturing,"  Semicon.du,ctor

                  Intern,ationaI,Jun. 1984 : 127.

       [ 16 ]  Levinson,W., " Statistical Process Control in Microelectronics Manufacturing," Semiconductor In.tern.atiotzal,

                       Cahners  Publishing,Nov. 1994 :95.

       [ 17 ]  Levy,K., " Productivity and Process Feedback, "  Solid State Technology,Jul. 1984:177.

  [18] Ibid.

       [ 19 ]  Hnatek,E., "IS0 9000 in the Semiconductor Industry, "  Semicon,du.ctor In,tern,ation,aI,Jul. 1993 :88.

      [ 20]  Dunn,P.,"The Unexpected Benefits of IS0 9000," Solid State Techn,ology,Mar. 1994:55.


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